Samsung, SK Hynix Postpone Hybrid Bonding for HBM4, Revert to Traditional Thermocompression

According to DIGITIMES, Samsung Electronics and SK Hynix have decided to postpone adoption of hybrid bonding technology for HBM4, reverting to traditional thermocompression bonding instead. The two companies made the change as the industry relaxes HBM thickness standards and customers delay their high-stack implementation timelines. Hybrid bonding is an advanced semiconductor packaging technique, with the industry previously expecting its earliest deployment in HBM4E.
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