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BASIC Semiconductor Signs CNY 193.3M SiC Packaging Line Contract in Shenzhen on July 28

2026-07-28 02:36:26

According to a company announcement on July 28, 2026, BASIC Semiconductor (09971) signed a general contracting agreement with China Construction Second Engineering Bureau for a silicon carbide module packaging line base project. The contract value is CNY 193.3 million (including tax), with a total building area of 59,357.54 square meters. The project, located in Pingshan District, Shenzhen, was approved by the Shenzhen Development and Reform Commission in April 2026. The company stated the project will support growing downstream demand in new energy vehicles, smart computing centers, and photovoltaic energy storage.

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