Samsung Electronics is reportedly reorganizing its new HBM chip development team

GoldenOctober2024

2024-07-04 12:40:01

On July 4th, Jinshi data, according to industry sources, Samsung Electronics’ Device Solutions (DS) department responsible for the semiconductor business underwent a reorganization, establishing a new HBM research and development group. Sun Yongzhu, Vice President of Samsung Electronics and a high-performance DRAM design expert, was appointed as the head of the research and development group, leading the team to focus on the development of HBM3, HBM3E, and the next-generation HBM4 technology. In addition, Samsung Electronics also reorganized the Advanced Packaging (AVP) team and the Equipment Technology Experiment Institute to enhance overall technological competitiveness.

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