Samsung to Supply Custom HBM for Nvidia's Feynman AI Chip via Hybrid Bonding Technology

According to BlockBeats, on July 21, Samsung Electronics began constructing a Die-to-Wafer hybrid bonding production line at its Pyeongtaek P5 facility to support next-generation advanced packaging for HBM and logic semiconductors. The company plans to acquire approximately 50 hybrid bonding systems from Dutch equipment maker Besi.

Analyst Jukan from Citrini stated that hybrid bonding technology is expected to be deployed in Nvidia's next-generation AI accelerator Feynman, which will use custom HBM. Samsung internally projects mass production around 2029-2030, aligning with the anticipated timeline for Nvidia's Feynman chip.